Samsung Electronics and Broadcom have signed a memorandum of understanding to broaden their strategic partnership across memory and foundry technology, aiming to support the next wave of AI infrastructure buildout.
The two companies unveiled the agreement at the AI Summit at The Midway in San Francisco, with Jinman Han, President and Head of Samsung Electronics’ Foundry Business, and Hock Tan, President and CEO of Broadcom, both in attendance alongside senior executives from each company and representatives of the Korean government.
The companies estimate the collaboration could be worth more than $200 billion across memory and foundry over the next five years, through 2030 — a figure that underscores how central both firms expect to remain to the AI hardware buildout over that stretch.
Memory Supply Centers on HBM
On the memory side, Samsung and Broadcom plan to work together on supplying advanced memory solutions, including High Bandwidth Memory, to support Broadcom’s next-generation AI accelerators.
HBM has become one of the most sought-after components in AI chip design, and Samsung’s involvement here signals its intent to remain a key supplier as demand for high-performance memory keeps climbing.
Foundry Work Targets Samsung’s Most Advanced Nodes
On foundry, the partnership centers on Samsung’s 2-nanometer and below process technologies, which Broadcom plans to use for its own products, including its Wireless Broadband Communications solutions. The collaboration is also expected to extend into advanced packaging built on Samsung’s 2nm process, including 2.3D and 2.5D integration — techniques aimed at squeezing more performance and power efficiency out of AI and networking silicon.
Executives Frame the Deal as an Ecosystem Play
Young Hyun Jun, Vice Chairman and CEO of Samsung’s Device Solutions Division, said AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging. He said expanding the collaboration with Broadcom across these areas positions Samsung to deliver greater value to customers while helping build out the AI infrastructure of the future.
Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, said close collaboration across the semiconductor ecosystem is becoming increasingly important as AI infrastructure continues to scale. He said combining Samsung’s memory and foundry expertise with Broadcom’s position in AI and connectivity should allow the two companies to keep delivering the technologies powering next-generation AI infrastructure.
Samsung Positions Itself as an End-to-End Supplier
With capabilities spanning memory, logic, foundry and advanced packaging, Samsung frames itself as uniquely equipped to offer integrated semiconductor solutions for the AI era. The expanded Broadcom partnership reflects that broader strategy — supplying end-to-end semiconductor technology across an increasingly wide range of AI and high-performance computing applications.